技術能力

Item

Mass Production

Try Run

Layers

32

42

Min  line / space

40/40um (1.6/1.6mil)

35/35um (1.4/1.4mil)

Min. laser drill diameter

70um (2.8mil)

65um (2.6mil)

Aspect ratio of PTH

16:1

18:1

Min  .core  thincknetss(excluding copper)

40um(1.6mil)

30um(1.2mil)

Anylayer  interconnection

5+2+5

6+2+10

Material

 FR4, Megtron, Nelco, Rogers, Heavy Copper, etc.

Surface Finish

 Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin, Flash gold, Gold finger plating, Selective hard gold plating, Peelable solder mask, Carbon ink

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